Inductor Modeling of Integrated Passive Device for RF Applications
نویسندگان
چکیده
In this paper, an integrated passive device (IPD) inductor modeling is demonstrated. The IPD technology is a system in package (SiP) solution where passive devices with high quality can be fabricated on a chip and then connect with another circuit chip by using flip-chip micro-bump bonding. For an RF circuit simulation, the IPD inductor model is built and verified from the measurement results. Key-Words: integrated passive device, system in package, flip-chip, inductor modeling
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